At the 'TSMC Technology Symposium 2026' in San Jose, the global semiconductor industry faced the urgent technical demands of the AI era. As AI processing power grows exponentially, the supporting memory technology must overcome traditional performance limits.

Ahn Hyun, President of Development at SK Hynix, emphasized 'Memory-Logic Integration' as the key to solving the persistent 'Memory Wall' issue. In current AI systems, the separation between logic chips that calculate data and memory chips that store it creates a bottleneck, limiting overall system speed.

To address this, SK Hynix plans to redesign memory architecture from the ground up, shifting toward 'Custom HBM' created in close collaboration with clients. A centerpiece of this strategy is the partnership with TSMC, where future HBM4 products will incorporate advanced logic processes directly onto the base die.

Beyond simple stacking, the integration of logic functions into memory and the use of 3D packaging like SoIC will vertically combine DRAM with logic semiconductors. This significantly reduces data travel distances, simultaneously boosting power efficiency and performance.

Demonstrating this 'Invisible Technology' concept, SK Hynix showcased a disassembled 12-layer HBM3E, illustrating the precision internal data processing invisible to the naked eye. By presenting 16-layer HBM4 and advanced server DRAM, the company highlighted its readiness for high-performance computing (HPC) demands.

This symposium marks a pivot for SK Hynix from a traditional supplier to a proactive system creator. By embedding this philosophy of 'integration' across its entire product lineup, the company is building a customer-centric AI memory ecosystem, likely widening its technological lead in the competitive HBM market.

At the 'TSMC Technology Symposium 2026' in San Jose, the global semiconductor industry faced the urgent technical demands of the AI era. As AI processing power grows exponentially, the supporting memory technology must overcome traditional performance limits.

Ahn Hyun, President of Development at SK Hynix, emphasized 'Memory-Logic Integration' as the key to solving the persistent 'Memory Wall' issue. In current AI systems, the separation between logic chips that calculate data and memory chips that store it creates a bottleneck, limiting overall system speed.

To address this, SK Hynix plans to redesign memory architecture from the ground up, shifting toward 'Custom HBM' created in close collaboration with clients. A centerpiece of this strategy is the partnership with TSMC, where future HBM4 products will incorporate advanced logic processes directly onto the base die.

Beyond simple stacking, the integration of logic functions into memory and the use of 3D packaging like SoIC will vertically combine DRAM with logic semiconductors. This significantly reduces data travel distances, simultaneously boosting power efficiency and performance.

Demonstrating this 'Invisible Technology' concept, SK Hynix showcased a disassembled 12-layer HBM3E, illustrating the precision internal data processing invisible to the naked eye. By presenting 16-layer HBM4 and advanced server DRAM, the company highlighted its readiness for high-performance computing (HPC) demands.

This symposium marks a pivot for SK Hynix from a traditional supplier to a proactive system creator. By embedding this philosophy of 'integration' across its entire product lineup, the company is building a customer-centric AI memory ecosystem, likely widening its technological lead in the competitive HBM market.