Applied Materials Emphasizes 3D Architecture for AI Chips

Applied Materials Korea CEO Kwang-sun Park presented 3D architecture as a core semiconductor technology for a sustainable AI era at Electronic Times Tech Summit 2026, held on the 28th at Conrad Seoul in Yeouido, Seoul. Park said semiconductor innovation is shifting from existing 2D planar structures to 3D structures, and he expects the transition to accelerate. His presentation was titled “Advancing AI Through Semiconductor and Materials Innovation.”

Park said three areas must overcome technical challenges to support a sustainable AI era: advanced logic, 3D DRAM and system integration. Advanced logic requires improvements to transistor and wiring structures, while memory faces the challenge of implementing 3D DRAM. In system integration, chiplets (structures that combine multiple chips) and advanced packaging are important for connecting chips and improving performance. He said all three areas are moving from 2D structures to 3D architecture.

Park said DRAM will ultimately move to a 3D structure, as NAND flash did when it shifted from 2D to 3D 10 years ago. Vertically stacking DRAM requires precise control of material properties and complex processes to etch deep internal structures uniformly or fill them without gaps.

Applied Materials projected in 2020 that the global semiconductor market would reach $1 trillion in 2030. Its updated forecast says the market had already reached that size as of September this year. The company said rising demand from AI adoption brought forward the market’s growth timeline.

Park said collaboration between companies is needed to accelerate technological innovation and cited the EPIC Center, which Applied Materials unveiled this month in Silicon Valley, California. The facility supports collaborative research and development in semiconductor process technology and manufacturing equipment. It is the world’s largest research and development facility, with a total investment of $5 billion. Samsung Electronics, SK Hynix and TSMC are participating, along with equipment companies and university researchers.

Park said commercializing an idea used to take more than 10 years, but the goal is now to cut that time by more than half. The EPIC Center plans to connect materials research, process and equipment development, module integration and production-scale validation at one site to shorten development and commercialization. Applied Materials is building a research lab in Osan, Gyeonggi Province, which it aims to open in 2028. Park said structural technologies are needed to accelerate AI innovation and that the company ultimately aims to support customers through “output innovation.”

Applied Materials Korea CEO Kwang-sun Park presented 3D architecture as a core semiconductor technology for a sustainable AI era at Electronic Times Tech Summit 2026, held on the 28th at Conrad Seoul in Yeouido, Seoul. Park said semiconductor innovation is shifting from existing 2D planar structures to 3D structures, and he expects the transition to accelerate. His presentation was titled “Advancing AI Through Semiconductor and Materials Innovation.”

Park said three areas must overcome technical challenges to support a sustainable AI era: advanced logic, 3D DRAM and system integration. Advanced logic requires improvements to transistor and wiring structures, while memory faces the challenge of implementing 3D DRAM. In system integration, chiplets (structures that combine multiple chips) and advanced packaging are important for connecting chips and improving performance. He said all three areas are moving from 2D structures to 3D architecture.

Park said DRAM will ultimately move to a 3D structure, as NAND flash did when it shifted from 2D to 3D 10 years ago. Vertically stacking DRAM requires precise control of material properties and complex processes to etch deep internal structures uniformly or fill them without gaps.

Applied Materials projected in 2020 that the global semiconductor market would reach $1 trillion in 2030. Its updated forecast says the market had already reached that size as of September this year. The company said rising demand from AI adoption brought forward the market’s growth timeline.

Park said collaboration between companies is needed to accelerate technological innovation and cited the EPIC Center, which Applied Materials unveiled this month in Silicon Valley, California. The facility supports collaborative research and development in semiconductor process technology and manufacturing equipment. It is the world’s largest research and development facility, with a total investment of $5 billion. Samsung Electronics, SK Hynix and TSMC are participating, along with equipment companies and university researchers.

Park said commercializing an idea used to take more than 10 years, but the goal is now to cut that time by more than half. The EPIC Center plans to connect materials research, process and equipment development, module integration and production-scale validation at one site to shorten development and commercialization. Applied Materials is building a research lab in Osan, Gyeonggi Province, which it aims to open in 2028. Park said structural technologies are needed to accelerate AI innovation and that the company ultimately aims to support customers through “output innovation.”